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  Schematic Capture
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CIRCUIT DESIGN

All of our circuit designers are qualified with several years of working experience in electronics engineering. For every project, we assign one of our senior design staff to communicate with your engineers to determine the objectives of your project, establish some initial parameters of the design, and open a channel of communication for the transfer of information.

Circuits are designed, starting with a written description of the objective. A small list of several design approaches is created, including the strengths and weaknesses of each. The potential design solutions are internally analyzed and costed. A sub-set of the original list, selected for their merit, is detailed and presented to the client for review.

We then create a general block diagram and break it down into small functional circuits. These functional circuits may be broken down again, into additional sub-circuits, depending on the complexity of the signal paths and logic. Sub-circuits may include programmable logic. Components are selected to satisfy the requirements of the circuit, and schematics are created. The captured schematics can be analyzed by circuit simulation and / or prototyping as required. The small functional circuit schematics are then combined into a full schematic representing the original block diagram. Again, the captured schematic can be further analyzed by circuit simulation and / or prototyping as required.

CADnCAM engineers have direct design experience in . . .

  • Low-level analog circuits, wireless RF & sensor applications
  • Power analog circuits, linear & switching power supplies
  • Digital design, including 8, 16, and 32 bit microcontrollers
  • High-speed digital design, including instrumentation and data collection
  • Mixed signal applications using DSP and A/D-D/A conversions
  • Programmable logic, FPGA and PLD design
     

In addition to circuit design, our engineering services include . . .

  • Comprehensive circuit evaluation
  • Through hole to SMT conversion
  • Miniaturization
  • Re-engineering for volume/cost
  • Design for Manufacture [DFM]
  • Product resuscitation
  • Alternative component selection
  • Migration from obsolete parts
  • Thermal issues, heatsink & cooling requirements
  • Shielding, guardbanding, and EMI

 

 

 

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